IE-6200BGA/LED Rework Station

FEATURES

  • Stable and Uniform Hot Air Heating System
  • Lower Heater Adjustable
  • Carbon Fiber Micro-crystalline Infrared Preheater
  • High-Precision PID Temperature Control System
  • High-Precision Optical Alignment System with Industrial High-Definition CCD (2MP)
  • High-Resolution Touch Screen HMI Interface
  • Automatic Placement, Soldering, Desoldering
  • Built-In Pressure Testing Device to Protects the PCB
  • Real-time Temperature Monitoring and Over-Temperature Protection.
  • Emergency Stop Function
  • SMD Feeding Device Support (Optional)
  • Add a side camera, more clearly observe the rework process(Optional)

Application

Suitable for Normal SMD (BGA, QFP etc.) & Micro-SMD Components Repair, Support P08 Small pitch LED beads, Min. 0,5mm * 0,5mm IC.

 

Specification
 

Model IE-6200 BGA LED Specification
Operation Mode Automatic / Optical /Touch Panel
Voltage/Power AC220V±10%(110V Optional), 50/60HZ / Top: 1200W, Bottom: 1200W, IR:
3200W
Heating Mode Top/Bottom Nozzle Hot Air, Bottom Plates Infrared
Temperature Precision 2-3 ℃ (1 Sensor Port)
Preheat Zone 280×380mm
Optical Alignment Precision 0.01MM
CCD Magnification 5X~50X
LCD Display 17〞1080P FHD LCD Display
For PCB Size/Chip Size PCB Size: 415*370MM~6*6MM / Chip Size: 0.6*0.6~40*40MM
Machine Dimension L640*W630*H920 (MM)
Net Weight 71KG
Standard Wooden Packing Packing Size: L750*W700*H950 (MM) / G.W: 120KG