FEATURES
- Stable and Uniform Hot Air Heating System
- Lower Heater Adjustable
- Carbon Fiber Micro-crystalline Infrared Preheater
- External Air (N2) Supply Control System
- High-Precision PID Temperature Control System
- Automatically High-Precision Optical Alignment System
- Industrial High-Definition CCD (2.0 MP)
- HD Touch Screen HMI Interface
- Automatic Placement, Desoldering
- Built-In Pressure Testing Device To Protects The PCB
- Real-Time Temperature Monitoring and Over-Temperature Protection
- Emergency Stop Function
- SMD Feeding Device Support (Optional)
- Add a side camera, more clearly observe the rework process (Optional)
Application
Suitable for Normal SMD (BGA, QFP etc.) & Micro-SMD Components Repair, Support P08 Small pitch LED beads, Min. 0,5mm * 0,5mm IC.
Specification
| Model |
IE-6800 BGA Specification |
| Operation Mode |
High Automatic / Optical / Laser / Touch Screen |
| Voltage/Power |
AC 380V, 50/60HZ / Top:1000W, Bottom:1200W, IR: 4000W |
| Heating Mode |
Top/Bottom Nozzle Hot Air, Bottom Plates Infrared |
| Preheating area size |
L380mm×W500mm |
| Material |
Servo Drive( Panasonic)＋8” Touch Screen＋PLC (Panasonic) |
| PCBA Positioning |
Universal Fixture + Laser Positioning |
| Temperature Precision |
±1℃, K-type thermocouple (Closed Loop, 6 Sensor Port) |
| Optical Alignment Precision |
0.01MM |
| CCD Magnification: |
5X~50X |
| For PCB Size/Chip Size |
PCB Size: 560*470~10*10MM Chip Size: 1*1~80*80MM |
| Machine Dimension |
L760*W850*H950(MM) |
| Net Weight |
150KG |
| Standard Wooden Packing |
Packing Size: L1150*W1250*H1350(MM)/ G.W: 205KG |
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