IE-6200BGA Rework Station
  • Stable and Uniform Hot Air Heating System
  • Lower Heater Adjustable
  • Carbon Fiber Infrared Pre-heater
  • High-Precision PID Temperature Control System
  • Industrial High-Definition CCD Camera (1.3MP)
  • High-Precision Optical Alignment System
  • High-Resolution Touch Screen HMI Interface
  • Automatic Placement, Desoldering
  • Built-In Pressure Sensor System To Protects The PCB
  • Real-Time Temperature Monitoring and Over-Temperature Protection.
  • Emergency Stop Function
  • Add a side camera, more clearly observe the rework process (Optional)

Application

Suitable for SMD (BGA, QFP etc.) Repair, Support IC Chips Min Size. 2mm * 2mm.

Specification
 

Model IE-6200BGA Specification
Operation Mode Automatic / Optical /Touch Panel
Voltage/Power AC220V±10%(110V Optional), 50/60HZ / Top: 1200W, Bottom: 1200W, IR:
2700W
Heating Mode Top/Bottom Nozzle Hot Air, Bottom Plates Infrared
Temperature Precision 2~3℃ (1 Sensor Port)
Preheat Zone 280×380mm
Optical Alignment Precision 0.01MM
CCD Magnification: 5X~50X
LCD Display 15〞720P HD LCD Display
For PCB Size/Chip Size PCB Size: 415*370~22*22MM / Chip Size: 2*2MM ~ 50*50MM
Machine Dimension L640*W630*H900 (MM)
Net Weight 79KG
Standard Wooden Packing Packing Size: L750*W700*H950(MM) / G.W: 120KG