- Stable and Uniform Hot Air Heating System
- Lower Heater Adjustable
- Carbon Fiber Infrared Pre-heater
- High-Precision PID Temperature Control System
- Industrial High-Definition CCD Camera (1.3MP)
- High-Precision Optical Alignment System
- High-Resolution Touch Screen HMI Interface
- Automatic Placement, Desoldering
- Built-In Pressure Sensor System To Protects The PCB
- Real-Time Temperature Monitoring and Over-Temperature Protection.
- Emergency Stop Function
- Add a side camera, more clearly observe the rework process (Optional)
Application
Suitable for SMD (BGA, QFP etc.) Repair, Support IC Chips Min Size. 2mm * 2mm.
Specification
| Model |
IE-6200BGA Specification |
| Operation Mode |
Automatic / Optical /Touch Panel |
| Voltage/Power |
AC220V±10%(110V Optional), 50/60HZ / Top: 1200W, Bottom: 1200W, IR:
2700W |
| Heating Mode |
Top/Bottom Nozzle Hot Air, Bottom Plates Infrared |
| Temperature Precision |
2~3℃ (1 Sensor Port) |
| Preheat Zone |
280×380mm |
| Optical Alignment Precision |
0.01MM |
| CCD Magnification: |
5X~50X |
| LCD Display |
15〞720P HD LCD Display |
| For PCB Size/Chip Size |
PCB Size: 415*370~22*22MM / Chip Size: 2*2MM ~ 50*50MM |
| Machine Dimension |
L640*W630*H900 (MM) |
| Net Weight |
79KG |
| Standard Wooden Packing |
Packing Size: L750*W700*H950(MM) / G.W: 120KG |
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