Independent air velocity controlling system allows flexible process control to easy handle complicated lead free soldering requirements. The RH-0802 has 2 ramp up zones, 4 soaking zones, 2 reflow zones, and 2 cooling zones. Profile spikes per zone is eliminated with better zone segmentation and decrease cross flow. Hole designs allow to cover the board with hot air in all direction for good uniformly. Center support system for preventing the de-formation of PCB board puzzle (Optional)...
INDEPENDENT AIR VELOCITY CONTROLLING SYSTEM ALLOWS FLEXIBLE PROCESSING CONTROL TO EASILY HANDLE COMPLICATED LEAD FREE SOLDERING REQUIREMENTS. CS series of reflow oven allows the heating zone temperature controllers have an accuracy of ±1°C and, in conjunction with a high-speed blower adjacent to each heat source for maximum convection, ensure a ΔT of ±2°C across the PCB assembly. The CS Series design provides low-velocity, low-turbulence air flow to prevent...
RT reflow soldering systems assure an optimum of process stability by innovative technology and are equipped with the following advantages: Special process chamber system for optimal temperature uniformity. Independent air velocity controlling system allows flexible process control to easy handle complicated lead free soldering requirements. Efficient power design and heat management system greatly improves energy savings while lowering carbon emissions. Multi-stage condensate...
