WTR-450 Wave Soldering Machine

Wave soldering system | Dual wave | Lead free | 4 zones Hot air preheating | Ti-alloy solder pot | Ti-alloy fingers
 

  • High capacity Ti-alloy solder pot
  • Built-inside flux spraying system
  • Forced convection hot air pre-heating zone
  • Full titanium alloy conveyor finger for lead free
  • Friendly HMI for ISO management
  • Low cost of ownership
  • Comprehensive warranty
  • Nitrogen system (Optional)
  • Center support system (Optional)
     

Model

WTR-450

Dimension (L*W*H) mm

4430*1620*1710

Weight (kg )

2300

Power supply

3P5W,380V /220 V , 50/60HZ 63A

Startup power

20 kw

Operation power consumption

12kw

Control system

Siemens PLC+Computer

Spray system

Transmission method

Stepping motor

Sprayer nozzle

Japan ST-6

Spray pressure

0.25MPa – 0.4 Mpa

FLUX flow arrange

10-100ml/min

FLUX supply

Automatic

Exhaust air

Up exhaust

Exhaust capacity           

25M3/min

Preheating system

Preheating method

Hot air

Control mode

PID+SSR

Preheating zones

Length :1800mm

Room temperature –250°C

Warmingup time

15 minutes ( setting 150°C )

Conveyor system

PCB Width (L*W) mm

Min : 80*60;Max:500*450

PCB Conveyor direction

LàR/ RàL (optional )

PCB Conveyor height (mm)

750+/- 20

Conveyor speed (mm/ min )

0-2000

Available components height (mm)

Top :120mm ( 160mm Optional ) Down: 15 mm

Finger

Special Titanium Claw

Rail width control

Auto

Conveyor angle

4°—7°

Soldering system

Soldering Pot style

Motor drive

Solder pot material

Titanium alloy

Wave

Duble wave

Wave height adjust

Digital control by PC

Heater power

380AC 12KW

Solder pot capability

HW-450: Pb-Free 480kg

Solder pot temperature

300°C

Solder pot warm-up time

Approx.180 min ( setting 250°C)

Temperature control mode

PID+SSR

Cooling system

Forced air cooling

Others

Finger cleaning system; Return Trip lifting( Standard )

Optional

Top IR pre-heating,Nitrogen system, Center support

1. Heavy Duty, High-Temperature Pumps and Motors


Dual, high-performance, high-temperature motors pump the molten solder through a titanium-alloy recirculating system and wave nozzles that are specially designed to minimize solder oxidation. Both motors include transducer-controlled flow adjustment to ensure precise wave height and uniformity.

2. Built-in Spraying flux system . Standard

A self-cleaning nozzle and pressure tank flux delivery system are included. The flux supply and flux flow-meter are also as the standard configuration in the system which allows to save the flux-consumption and make guaranty of spraying uniformly.

3. Forced convection hot air pre-heating zone

There is a three-zone, high-capacity, forced hot air convection preheater with independent zone temperature controls to allow precise thermal profiling for proper flux activation and optimal solder wetting as assemblies enter the wave module. Each one-piece preheat module is designed to be interchangeable and easy drop-down removal, promoting the ultimate in process flexibility. Micro air circulation design in the machine is to realize the more uniform heating effect. You can also control the speed motor of convection at preheating.

4. Double Chain Titanium Finger Conveyor Includes Motorized Width Adjustment ( for PCB and PCB with carrier)

Titanium Finger Conveyor Includes Motorized Width Adjustment, from 50-350 mm (450mm), is standard on all HW Wave Soldering Systems, dramatically reducing setup time and eliminating operator inconsistency. Other conveyor widths are available: 300 mm,450mm. An aluminum-alloy pin-type conveyor input mechanism feeds the dual-titanium-finger conveyor which includes a built-in finger cleaner.

 

An optional center PCB support rail can be added to maintain planarity and to prevent sagging of oversize boards through the wave module. A special recycle liquid brush finger cleaner and inlet conveyor are provided as standard. Easily removable titanium fingers make maintenance simple.Conveyor angle is adjustable from 4° - 7° and nominal speed setting is variable from 0.5 - 2.2 m/min (20"-87"/min) for maximized throughput.