Specification:

Key Features

• ✅ Max. PCB size: 600 × 650 mm
• ✅ 60 layers with max. 3 kg per layer
• ✅ Max. component height: 25 mm
• ✅ Temperature range up to 200°C with ±1°C control accuracy
• ✅ Inner temperature uniformity: < ±2°C
• ✅ 8 independent heating modules (total 72 kW)
• ✅ Servo motor driven lifting system for precise and smooth operation
• ✅ In-line automatic entry & exit conveyors
• ✅ Hermes protocol ready (Industry 4.0 compatible)
• ✅ Optional N₂ atmosphere and Cleanroom configuration
• ✅ Manual or automatic rail width adjustment

Advantages

• Saves valuable factory floor space compared to traditional horizontal ovens
• High throughput – minimum cycle time 12 seconds per PCB
• Clean electric heating – pollution-free and low noise
• Excellent for curing capacitors, resistors, inductors, and assembled PCBs